HEAT AND TEMPERATURE MONITORING DEVICE

At least one embodiment of the invention relates to a temperature and heat monitoring device comprising a housing, at least one microcontroller disposed in the housing, at least one sensor configured to determine an amount of heat adjacent to the device, at least one memory configured to store a pre...

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Bibliographic Details
Main Authors Woo, Timothy Ken-Wing, MICHEL, Danielle Marie
Format Patent
LanguageEnglish
Published 02.08.2018
Subjects
ALARM SYSTEMS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
ORDER TELEGRAPHS
PHYSICS
SELECTING
SIGNALLING
SIGNALLING OR CALLING SYSTEMS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Summary:At least one embodiment of the invention relates to a temperature and heat monitoring device comprising a housing, at least one microcontroller disposed in the housing, at least one sensor configured to determine an amount of heat adjacent to the device, at least one memory configured to store a predetermined set of values relating to heat and at least one power source in communication with the microcontroller. There is also at least one transmitter configured to communicate with an adjacent electronic device, wherein said at least one microcontroller is configured to read signals from said at least one sensor, and to determine whether the information from said sensor is outside of said predetermined set of values relating to heat and then to selectively send a signal to the adjacent electronic device to indicate a heat or temperature condition.
Bibliography:Application Number: US201815881470