MICROELECTRONIC PACKAGE COMMUNICATION USING RADIO INTERFACES CONNECTED THROUGH WAVEGUIDES

Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrate...

Full description

Saved in:
Bibliographic Details
Main Authors KAMGAING, Telesphor, RAWLINGS, Brandon M, OSTER, Sasha N, ELSHERBINI, Adel A, DOGIAMIS, Georgios C
Format Patent
LanguageEnglish
Published 02.08.2018
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
PHYSICS
TELEPHONIC COMMUNICATION
Online AccessGet full text

Cover

More Information
Summary:Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.
Bibliography:Application Number: US201515746318