SELF-ALIGNED VIA FORMING TO CONDUCTIVE LINE AND RELATED WIRING STRUCTURE

• Main Authors: Anderson, Brent A, Nowak, Edward J
• Format: Patent
• Language: English
• Published: 26.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of forming a via and a wiring structure formed are disclosed. The method may include forming a conductive line in a first dielectric layer; forming a hard mask adjacent to the conductive line after the conductive line forming; forming a second dielectric layer over the hard mask; and formin...