COMPOSITE HEAT-DISSIPATING SUBSTRATE

• Main Authors: LIN, Hsing-Yen, LAW, Pi-Cheng, LIU, Bo-Wei, HUANG, Po-Chao, SU, Hua-Hsin, DENG, Ya-Hsin
• Format: Patent
• Language: English
• Published: 05.07.2018
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; BLASTING; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LIGHTING; MECHANICAL ENGINEERING; METALLURGY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WEAPONS

The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer. The heat-dissipating substrate includes a substrate body and a socket formed on the substrate body; and the heat-conducting metal layer widely covers the socket of the substrate body and have one side formed as a loaded side on which a laser semiconductor is to be mounted and a opposite side formed as a heat-dissipating side, so that after the loaded side absorbs heat from the laser semiconductor, the heat-dissipating side reverse to the heat-conducting metal layer diffuses the heat to the heat-dissipating substrate.