BUMPED ELECTRODE ARRAYS FOR MICROASSEMBLERS

An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate for the electrode array. The method also includes disposing a plurality of non-planar structures including electrodes above the substrate of th...

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Bibliographic Details
Main Authors Bert, Julie A, Raychaudhuri, Sourobh, Biegelsen, David K
Format Patent
LanguageEnglish
Published 28.06.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate for the electrode array. The method also includes disposing a plurality of non-planar structures including electrodes above the substrate of the electrode array. The method further includes disposing a dielectric layer above the plurality of non-planar structures having a defined radius of curvature.
Bibliography:Application Number: US201615391140