MOUNTING SUBSTRATE AND ELECTRONIC APPARATUS

A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a fine L/S layer (40) formed in contact with a top surface of the wiring substrate; and a plurality of elements (12, 13) arranged in a matrix on a top surface of the fine L/S layer. The wirin...

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Bibliographic Details
Main Author Aoyagi, Akiyoshi
Format Patent
LanguageEnglish
Published 21.06.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a fine L/S layer (40) formed in contact with a top surface of the wiring substrate; and a plurality of elements (12, 13) arranged in a matrix on a top surface of the fine L/S layer. The wiring substrate includes a plurality of first wiring lines (SigB1, Gate2), and a plurality of vias (14) arranged at a period corresponding to an integral multiple of an arrangement period of the plurality of element, and two or more of the vias are provided for each of the first wiring lines. Two or more adjacent ones of the elements on the fine L/S layer are electrically coupled to common one of the vias through one or more second wiring lines (16).
Bibliography:Application Number: US201515128443