SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The...

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Bibliographic Details
Main Authors HAN, Ying-Shin, LIN, Yen-Miao, MENG, Hsien-Liang, CHEN, Chung-Chih
Format Patent
LanguageEnglish
Published 14.06.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The cap portion and the foot portion define a recess, and the integrated circuit die is accommodated in the recess. The adhesive includes a sidewall portion and a bottom portion. The sidewall portion contacts a sidewall of the foot portion. The bottom portion extends from the sidewall portion to between a bottom surface of the foot portion and the substrate.
Bibliography:Application Number: US201715616908