SEMICONDUCTOR DEVICE HAVING A MEMORY CELL ARRAY PROVIDED INSIDE A STACKED BODY
According to one embodiment, a semiconductor device includes a stacked body, a memory cell array, and a columnar portion. The stacked body is provided on a major surface of a substrate. The stacked body includes a plurality of electrode layers stacked with an insulating body interposed. The memory c...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
17.05.2018
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| Subjects | |
| Online Access | Get full text |
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| Abstract | According to one embodiment, a semiconductor device includes a stacked body, a memory cell array, and a columnar portion. The stacked body is provided on a major surface of a substrate. The stacked body includes a plurality of electrode layers stacked with an insulating body interposed. The memory cell array is provided inside the stacked body. The columnar portion is provided inside the memory cell array. The columnar portion extends along a stacking direction of the stacked body. The columnar portion includes a semiconductor body and a memory film. The memory film includes a charge storage portion. The substrate includes a first contact portion contacting the semiconductor body. A configuration of the first contact portion is convex along the stacking direction. |
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| AbstractList | According to one embodiment, a semiconductor device includes a stacked body, a memory cell array, and a columnar portion. The stacked body is provided on a major surface of a substrate. The stacked body includes a plurality of electrode layers stacked with an insulating body interposed. The memory cell array is provided inside the stacked body. The columnar portion is provided inside the memory cell array. The columnar portion extends along a stacking direction of the stacked body. The columnar portion includes a semiconductor body and a memory film. The memory film includes a charge storage portion. The substrate includes a first contact portion contacting the semiconductor body. A configuration of the first contact portion is convex along the stacking direction. |
| Author | KITAHARA, Yoshiyuki |
| Author_xml | – fullname: KITAHARA, Yoshiyuki |
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| Notes | Application Number: US201815870144 |
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| PublicationYear | 2018 |
| RelatedCompanies | Toshiba Memory Corporation |
| RelatedCompanies_xml | – name: Toshiba Memory Corporation |
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| Snippet | According to one embodiment, a semiconductor device includes a stacked body, a memory cell array, and a columnar portion. The stacked body is provided on a... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SEMICONDUCTOR DEVICE HAVING A MEMORY CELL ARRAY PROVIDED INSIDE A STACKED BODY |
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