SEMICONDUCTOR DEVICE HAVING A MEMORY CELL ARRAY PROVIDED INSIDE A STACKED BODY

According to one embodiment, a semiconductor device includes a stacked body, a memory cell array, and a columnar portion. The stacked body is provided on a major surface of a substrate. The stacked body includes a plurality of electrode layers stacked with an insulating body interposed. The memory c...

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Bibliographic Details
Main Author KITAHARA, Yoshiyuki
Format Patent
LanguageEnglish
Published 17.05.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to one embodiment, a semiconductor device includes a stacked body, a memory cell array, and a columnar portion. The stacked body is provided on a major surface of a substrate. The stacked body includes a plurality of electrode layers stacked with an insulating body interposed. The memory cell array is provided inside the stacked body. The columnar portion is provided inside the memory cell array. The columnar portion extends along a stacking direction of the stacked body. The columnar portion includes a semiconductor body and a memory film. The memory film includes a charge storage portion. The substrate includes a first contact portion contacting the semiconductor body. A configuration of the first contact portion is convex along the stacking direction.
Bibliography:Application Number: US201815870144