ADDITIVE FOR COPPER ELECTROPLATING BATH, COPPER ELECTROPLATING BATH CONTAINING SAID ADDITIVE, AND COPPER ELECTROPLATING METHOD USING SAID COPPER ELECTROPLATING BATH

(In the formulae, X represents at least one unit selected from units represented by specific structures, and a ratio of a to b, i.e. "a:b" falls within the range of from 10:90 to 99:1.)

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Bibliographic Details
Main Authors ZUSHI, Takehiro, YOSHII, Takahiro, HATSUKADE, Tomoko, TAKAHASHI, Takuya
Format Patent
LanguageEnglish
Published 17.05.2018
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:(In the formulae, X represents at least one unit selected from units represented by specific structures, and a ratio of a to b, i.e. "a:b" falls within the range of from 10:90 to 99:1.)
Bibliography:Application Number: US201715850091