SUBSTRATE INTERCONNECTIONS FOR PACKAGED SEMICONDUCTOR DEVICE

A "universal" substrate for a semiconductor device is formed of a non-conductive substrate material. A uniform array of conductive pillars is formed in the substrate material. The pillars extend from a top surface of the substrate material to a bottom surface of the substrate material. A d...

Full description

Saved in:
Bibliographic Details
Main Authors Kalandar, Navas Khan Oratti, He, Bihua, Tan, Lan Chu, Yow, Kai Yun, Foong, Chee Seng, Zang, Yuan
Format Patent
LanguageEnglish
Published 26.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A "universal" substrate for a semiconductor device is formed of a non-conductive substrate material. A uniform array of conductive pillars is formed in the substrate material. The pillars extend from a top surface of the substrate material to a bottom surface of the substrate material. A die flag may be formed on the top surface of the substrate material. Pillars underneath the die flag are connected to pillars beyond a perimeter of the die flag with wires. Power and ground rings may be formed by connecting rows of pillars that surround the die flag.
Bibliography:Application Number: US201615381058