THERMAL INTERFACES FOR INTEGRATED CIRCUIT PACKAGES

A thermal interface may include a wired network made of a first TIM, and a second TIM surrounding the wired network. A heat spreader lid may include a wired network attached to an inner surface of the heat spreader lid. An IC package may include a heat spreader lid placed over a first electronic com...

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Bibliographic Details
Main Authors Cetegen Edvin, Dhane Kedar, Karhade Omkar G, Jha Chandra M
Format Patent
LanguageEnglish
Published 29.03.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A thermal interface may include a wired network made of a first TIM, and a second TIM surrounding the wired network. A heat spreader lid may include a wired network attached to an inner surface of the heat spreader lid. An IC package may include a heat spreader lid placed over a first electronic component and a second electronic component. A first thermal interface may be formed between the first electronic component and the inner surface of the heat spreader lid, and a second thermal interface may be formed between the second electronic component and the inner surface of the heat spreader lid. The first thermal interface may include a wired network of a first TIM surrounded by a second TIM, while the second thermal interface may include the second TIM, without a wired network of the first TIM. Other embodiments may be described and/or claimed.
Bibliography:Application Number: US201615279222