LIGHT EMITTING DIODE COMPONENT

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive t...

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Bibliographic Details
Main Authors Stimac Tomislav J, Radkov Emil V, Reginelli James, Mrakovich Matthew, Soules Thomas F, Weaver, JR. Stanton Earl, Aanegola Srinath K, Stadelman Larry R
Format Patent
LanguageEnglish
Published 22.03.2018
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Summary:In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
Bibliography:Application Number: US201313886878