SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite...

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Bibliographic Details
Main Authors ITAI Junichi, MIREBA Kazuhiro, KOBAYAKAWA Masahiko, YASUDA Shintaro, OKADA Taisuke
Format Patent
LanguageEnglish
Published 15.03.2018
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Summary:A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad. The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
Bibliography:Application Number: US201715818202