Barrier Layer Formation Using Thermal Processing

• Main Authors: Joshi Ravi Keshav, Wang Kae-Horng, Willkofer Stefan
• Format: Patent
• Language: English
• Published: 01.03.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of fabricating a semiconductor device includes forming a barrier layer over a surface of a semiconductor substrate. A treated barrier layer is formed by subjecting an exposed surface of the barrier layer to a surface treatment process. The surface treatment process includes treating the sur...