ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME

A method of fabricating an electronic device, the method including: arranging a device chip with no bump located on a lower surface of the device chip on a mounting substrate including a bump located on an upper surface of the mounting substrate; and bonding a pad located on the lower surface of the...

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Bibliographic Details
Main Authors KONNO Jumpei, YAMAMOTO Shinji, MIYAGAWA Takashi
Format Patent
LanguageEnglish
Published 01.02.2018
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:A method of fabricating an electronic device, the method including: arranging a device chip with no bump located on a lower surface of the device chip on a mounting substrate including a bump located on an upper surface of the mounting substrate; and bonding a pad located on the lower surface of the device chip and the bump by applying an ultrasonic wave to the device chip from an upper surface of the device chip.
Bibliography:Application Number: US201715646399