THROUGH SILICON VIA SHARING IN A 3D INTEGRATED CIRCUIT

The present disclosure generally relates to semiconductor structures and, more particularly, to intelligent through silicon via sharing in 3D-IC integrated structures and methods of manufacture. The structure includes: a plurality of stacked dies each containing at least one macro device; and a laye...

Full description

Saved in:
Bibliographic Details
Main Authors Ventrone Sebastian T, Mandal Sudeep
Format Patent
LanguageEnglish
Published 18.01.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
Online AccessGet full text

Cover

More Information
Summary:The present disclosure generally relates to semiconductor structures and, more particularly, to intelligent through silicon via sharing in 3D-IC integrated structures and methods of manufacture. The structure includes: a plurality of stacked dies each containing at least one macro device; and a layer structure positioned between the plurality of stacked dies which comprises a control structured to route signals between the at least one macro device of a first stacked die and the at least one macro device of a second stacked die of the plurality of stacked dies.
Bibliography:Application Number: US201615210403