Photosensitive Assembly and Camera Module and Manufacturing Method Thereof

A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated...

Full description

Saved in:
Bibliographic Details
Main Authors WANG Mingzhu, ZHAO Bojie, DENG Zilong, TANAKA Takehiko, GUO Nan, LUAN Zhongyu, CHEN Zhenyu, XI Fengsheng, HUANG Zhen, JIANG Heng
Format Patent
LanguageEnglish
Published 04.01.2018
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
Online AccessGet full text

Cover

More Information
Summary:A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
Bibliography:Application Number: US201715473565