LAYOUT OF TRANSMISSION VIAS FOR MEMORY DEVICE

Apparatuses and methods for supplying power to a plurality of dies are described. An example apparatus includes: a substrate; first, second and third memory cell arrays arranged in line in a first direction in the substrate; a first set of through electrodes arranged between the first and second mem...

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Bibliographic Details
Main Author Shibata Kayoko
Format Patent
LanguageEnglish
Published 04.01.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Summary:Apparatuses and methods for supplying power to a plurality of dies are described. An example apparatus includes: a substrate; first, second and third memory cell arrays arranged in line in a first direction in the substrate; a first set of through electrodes arranged between the first and second memory cell arrays, each of the first set of through electrodes penetrating through the substrate, the first set of through electrodes including first and second through electrodes; and a second set of through electrodes arranged between the second and third memory cell arrays, each of the second set of through electrodes penetrating through the substrate, the second set of through electrodes including third and fourth through electrodes.
Bibliography:Application Number: US201715661846