Manufacturing method for insulation layer, manufacturing method for array substrate and array substrate

A manufacturing method for insulation layer, a manufacturing method for array substrate and an array substrate are disclosed. Wherein, the manufacturing method for insulation layer comprises steps of: depositing an insulation layer on a substrate; exposing and developing the insulation layer in orde...

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Bibliographic Details
Main Author FAN Deyong
Format Patent
LanguageEnglish
Published 04.01.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A manufacturing method for insulation layer, a manufacturing method for array substrate and an array substrate are disclosed. Wherein, the manufacturing method for insulation layer comprises steps of: depositing an insulation layer on a substrate; exposing and developing the insulation layer in order to obtain the insulation layer having an opening; light curing the insulation layer having the opening; and performing a high-temperature annealing treatment to the insulation layer having the opening after being light cured. Adopting the manufacturing method for insulation layer of the present invention, a situation of deformation at the opening of the insulation layer can be reduced.
Bibliography:Application Number: US201615116497