Reticle Cooling by Non-Uniform Gas Flow

An apparatus, system, and method cool a patterning device by supplying a non-uniform gas flow. The apparatus and system include a gas supply structure that supplies a gas flow across the first surface of the patterning device. The gas supply structure includes a gas supply nozzle specially configure...

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Bibliographic Details
Main Authors DELPUERTO Santiago E, WARD Christopher Charles, VOGEL Herman, SCHULTZ Geoffrey Alan, BURBANK Daniel Nathan, VAN BOKHOVEN Laurentius Johannes Adrianus, ONVLEE Johannes, VENTURINO Thomas, GALBURT Daniel Nicholas
Format Patent
LanguageEnglish
Published 21.12.2017
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:An apparatus, system, and method cool a patterning device by supplying a non-uniform gas flow. The apparatus and system include a gas supply structure that supplies a gas flow across the first surface of the patterning device. The gas supply structure includes a gas supply nozzle specially configured to create a non-uniform gas flow distribution. A greater volume or velocity of the gas flow is directed to desired portion of the patterning device.
Bibliography:Application Number: US201515540649