CHIP CARRIERS AND SEMICONDUCTOR DEVICES INCLUDING REDISTRIBUTION STRUCTURES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE

A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the diel...

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Bibliographic Details
Main Authors Scharf Thorsten, Jordan Steffen
Format Patent
LanguageEnglish
Published 30.11.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.
Bibliography:Application Number: US201715590520