IN-PLANE ACTIVE COOLING DEVICE FOR MOBILE ELECTRONICS
An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the...
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Format | Patent |
Language | English |
Published |
05.10.2017
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Abstract | An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode. |
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AbstractList | An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode. |
Author | MITTER Vinay WANG Peng VADAKKANMARUVEEDU Unnikrishnan |
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Snippet | An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a... |
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SubjectTerms | BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS |
Title | IN-PLANE ACTIVE COOLING DEVICE FOR MOBILE ELECTRONICS |
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