IN-PLANE ACTIVE COOLING DEVICE FOR MOBILE ELECTRONICS

An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the...

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Main Authors MITTER Vinay, VADAKKANMARUVEEDU Unnikrishnan, WANG Peng
Format Patent
LanguageEnglish
Published 05.10.2017
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Abstract An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.
AbstractList An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.
Author MITTER Vinay
WANG Peng
VADAKKANMARUVEEDU Unnikrishnan
Author_xml – fullname: MITTER Vinay
– fullname: VADAKKANMARUVEEDU Unnikrishnan
– fullname: WANG Peng
BookMark eNrjYmDJy89L5WQw9fTTDfBx9HNVcHQO8QxzVXD29_fx9HNXcHEN83R2VXDzD1Lw9Xfy9HFVcPVxdQ4J8vfzdA7mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBobmRhYm5gYWjobGxKkCAHHOKiE
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2017284708A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2017284708A13
IEDL.DBID EVB
IngestDate Fri Aug 30 05:41:16 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2017284708A13
Notes Application Number: US201615086039
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171005&DB=EPODOC&CC=US&NR=2017284708A1
ParticipantIDs epo_espacenet_US2017284708A1
PublicationCentury 2000
PublicationDate 20171005
PublicationDateYYYYMMDD 2017-10-05
PublicationDate_xml – month: 10
  year: 2017
  text: 20171005
  day: 05
PublicationDecade 2010
PublicationYear 2017
RelatedCompanies QUALCOMM Incorporated
RelatedCompanies_xml – name: QUALCOMM Incorporated
Score 3.1048267
Snippet An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a...
SourceID epo
SourceType Open Access Repository
SubjectTerms BLASTING
COMBINED HEATING AND REFRIGERATION SYSTEMS
ELECTRICITY
HEAT PUMP SYSTEMS
HEATING
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
REFRIGERATION MACHINES, PLANTS OR SYSTEMS
REFRIGERATION OR COOLING
WEAPONS
Title IN-PLANE ACTIVE COOLING DEVICE FOR MOBILE ELECTRONICS
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171005&DB=EPODOC&locale=&CC=US&NR=2017284708A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3da8IwED_EjW1vm9vYhxuBjb6VRWuqPsjQNJ0dtS3aFt-kqREGo8rs2L-_JNTNJ9-SHFw-4O5yyd3vAJ5FW0oY6VpmviTC7AhsmX171TVx1soUxBTmutzbJLDHSed9TuY1-Nzlwmic0B8NjiglKpfyXmp9vfl_xHJ0bOX2hX_IofWrGw8co_KOWwqrhhjOaMCi0AmpQekgmRnBVNOUJsa9ofSVjtRFWiHts3Sk8lI2-0bFPYfjSPIryguoiaIBp3RXe60BJ5Pqy1s2K-nbXgLxAjPyhwFDKvQjZYiGoe8Fb8hhqUcZkg4dmoQjz2eI-YzG0zDw6OwKnlwW07Ep51_8bXeRzPYXa11DvVgX4gaQsATGgvfE0uIdvmxnLZFnK5v3eR_bORe30DzE6e4w-R7OVFcHqpEm1Muvb_EgDW7JH_U5_QJCxH69
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOKbokYUtYlmb4uDfQAPi4Guc9N9EBiEN7JuJTExg8iM_75tM5Qn3ppecr02ubtee_c7gCfW5Rpm9nQ1y02mGkzT1YG16qla2kkFxJRGZbu3MLK8mfG2MBc1-NzVwkic0B8Jjsg1KuP6Xkp7vfl_xHJkbuX2mX7wqfWLm9iOUkXHHYFVYyrOyCbj2ImxgrE9myrRRNKEJdb6Qx4rHfUEPq-4PM1Hoi5ls-9U3DM4HnN-RXkONVY0oYF3vdeacBJWX958WGnf9gJMP1LHwTAiSKR-zAnCcRz40StyyNzHBPGADoXxyA8IIgHBySSOfDy9hEeXJNhT-frLv-0uZ9N9YfUrqBfrgl0DYjrTNEb7LNepQfNu2mFZurLogPLNZJS1oH2I081h8gM0vCQMllzu91s4FSSZtGa2oV5-fbM77nxLei_P7BdYh4Gq
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=IN-PLANE+ACTIVE+COOLING+DEVICE+FOR+MOBILE+ELECTRONICS&rft.inventor=MITTER+Vinay&rft.inventor=VADAKKANMARUVEEDU+Unnikrishnan&rft.inventor=WANG+Peng&rft.date=2017-10-05&rft.externalDBID=A1&rft.externalDocID=US2017284708A1