IN-PLANE ACTIVE COOLING DEVICE FOR MOBILE ELECTRONICS

An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the...

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Bibliographic Details
Main Authors MITTER Vinay, VADAKKANMARUVEEDU Unnikrishnan, WANG Peng
Format Patent
LanguageEnglish
Published 05.10.2017
Subjects
BLASTING
COMBINED HEATING AND REFRIGERATION SYSTEMS
ELECTRICITY
HEAT PUMP SYSTEMS
HEATING
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
REFRIGERATION MACHINES, PLANTS OR SYSTEMS
REFRIGERATION OR COOLING
WEAPONS
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Summary:An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.
Bibliography:Application Number: US201615086039