Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

• Main Authors: WANG Mingzhu, ZHAO Bojie, DING Liang, TANAKA Takehiko, CHEN Feifan, GUO Nan, LUAN Zhongyu, CHEN Zhenyu, XI Fengsheng, JIANG Heng
• Format: Patent
• Language: English
• Published: 14.09.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; PRINTED CIRCUITS

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.