INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE

Insulating a via in a semiconductor substrate, including: depositing, in the via, a dielectric layer; depositing, in the via, a barrier layer; allowing the barrier layer to oxidize; and depositing, in the via, a conducting layer.

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Bibliographic Details
Main Authors SIMON ANDREW H, REARDON NICOLE R, PETRARCA KEVIN S, OAKLEY JENNIFER A, FAROOQ MUKTA G
Format Patent
LanguageEnglish
Published 07.09.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Insulating a via in a semiconductor substrate, including: depositing, in the via, a dielectric layer; depositing, in the via, a barrier layer; allowing the barrier layer to oxidize; and depositing, in the via, a conducting layer.
Bibliography:Application Number: US201715601488