INTEGRATED CIRCUIT DIE HAVING BACKSIDE PASSIVE COMPONENTS AND METHODS ASSOCIATED THEREWITH

Embodiments of the present disclosure are directed towards an integrated circuit (IC) die. In embodiments, the IC die may include a semiconductor substrate, a plurality of active components disposed on a first side of the semiconductor substrate, and a plurality of passive components disposed on a s...

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Bibliographic Details
Main Author LEE Kevin J
Format Patent
LanguageEnglish
Published 31.08.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments of the present disclosure are directed towards an integrated circuit (IC) die. In embodiments, the IC die may include a semiconductor substrate, a plurality of active components disposed on a first side of the semiconductor substrate, and a plurality of passive components disposed on a second side of the semiconductor substrate. In embodiments the second side may be disposed opposite the first side. The passive components may, in some embodiments, include capacitors and/or resistors while the active components may, in some embodiments, include transistors. Other embodiments may be described and/or claimed.
Bibliography:Application Number: US201415503377