SEMICONDUCTOR MEMORY DEVICE

According to an embodiment, a semiconductor memory device comprises: a stacked body including control gate electrodes stacked upwardly of a substrate; a semiconductor layer facing the control gate electrodes; and a gate insulating layer provided between the control gate electrode and the semiconduct...

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Main Authors KONAGAI Satoshi, KOBAYASHI Shigeki, SHINGU Masao, MIKAJIRI Yoshimasa, KONNO Atsushi, YAMADA Kenta, HIGUCHI Masaaki, KITAZAKI Soichiro
Format Patent
LanguageEnglish
Published 24.08.2017
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Summary:According to an embodiment, a semiconductor memory device comprises: a stacked body including control gate electrodes stacked upwardly of a substrate; a semiconductor layer facing the control gate electrodes; and a gate insulating layer provided between the control gate electrode and the semiconductor layer. The stacked body comprises: a first metal layer configuring the control gate electrode; a first barrier metal layer contacting an upper surface of this first metal layer; a first silicon nitride layer contacting an upper surface of this first barrier metal layer; a first inter-layer insulating layer contacting an upper surface of this first silicon nitride layer; a second barrier metal layer contacting a lower surface of the first metal layer; a second silicon nitride layer contacting a lower surface of this second barrier metal layer; and a second inter-layer insulating layer contacting a lower surface of this second silicon nitride layer.
Bibliography:Application Number: US201615269082