INTERCONNECT RELIABILITY STRUCTURES
The present disclosure relates to semiconductor structures and, more particularly, to interconnect reliability structures and methods of manufacture. The structure includes: a plurality of resistors; and a voltmeter configured to sense a relative difference in resistance of the plurality of resistor...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
24.08.2017
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure relates to semiconductor structures and, more particularly, to interconnect reliability structures and methods of manufacture. The structure includes: a plurality of resistors; and a voltmeter configured to sense a relative difference in resistance of the plurality of resistors indicative of at least one of a via-depletion and line-depletion. |
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Bibliography: | Application Number: US201615048704 |