MULTIFREQUENCY CAPACITIVELY COUPLED PLASMA ETCH CHAMBER
A plasma processing system for use with a gas. The plasma processing system comprises a first electrode, a second electrode, a gas input port, a power source and a passive circuit. The gas input port is operable to provide the gas between the first electrode and the second electrode. The power sourc...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
27.07.2017
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Subjects | |
Online Access | Get full text |
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Summary: | A plasma processing system for use with a gas. The plasma processing system comprises a first electrode, a second electrode, a gas input port, a power source and a passive circuit. The gas input port is operable to provide the gas between the first electrode and the second electrode. The power source is operable to ignite plasma from the gas between the first electrode and the second electrode. The passive circuit is coupled to the second electrode and is configured to adjust one or more of an impedance, a voltage potential, and a DC bias potential of the second electrode. The passive radio frequency circuit comprises a capacitor arranged in parallel with an inductor. |
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Bibliography: | Application Number: US20090533984 |