HERMETIC SEALING METHOD AND HERMETIC-SEALED SUBSTRATE PACKAGE

The present invention relates to a hermetic sealing method and a hermetic-sealed substrate package and, more specifically, to a hermetic sealing method for hermetically sealing the space between two substrates by a glass frit paste, and a substrate package manufactured thereby. To this end, the pres...

Full description

Saved in:
Bibliographic Details
Main Authors Yang Choon Bong, Kim Bo Mi, Kim Jhee Mann, Lee Ki Yeon, Oh Yoon Seuk
Format Patent
LanguageEnglish
Published 13.07.2017
Subjects
CHEMISTRY
GLASS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METALLURGY
MINERAL OR SLAG WOOL
Online AccessGet full text

Cover

More Information
Summary:The present invention relates to a hermetic sealing method and a hermetic-sealed substrate package and, more specifically, to a hermetic sealing method for hermetically sealing the space between two substrates by a glass frit paste, and a substrate package manufactured thereby. To this end, the present invention provides a hermetic sealing method comprising: a substrate preparation step for preparing a first substrate and a second substrate smaller than the first substrate; a glass frit paste applying step for applying the glass frit paste such that the glass frit paste adheres to the upper periphery of the first substrate and a side of the second substrate while the first and second substrates are disposed to face each other; and a laser irradiation step for irradiating a laser beam to the applied glass frit paste to hermetically seal the space between the first and second substrates.
Bibliography:Application Number: US201515326340