METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING MOISTURE-RESISTANT RINGS BEING FORMED IN A PERIPHERAL REGION
A semiconductor device includes a first moisture-resistant ring disposed in a peripheral region surrounding a circuit region on a semiconductor substrate in such a way as to surround the circuit region and a second moisture-resistant ring disposed in the peripheral region in such a way as to surroun...
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Format | Patent |
Language | English |
Published |
29.06.2017
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Subjects | |
Online Access | Get full text |
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Abstract | A semiconductor device includes a first moisture-resistant ring disposed in a peripheral region surrounding a circuit region on a semiconductor substrate in such a way as to surround the circuit region and a second moisture-resistant ring disposed in the peripheral region in such a way as to surround the first moisture-resistant ring. |
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AbstractList | A semiconductor device includes a first moisture-resistant ring disposed in a peripheral region surrounding a circuit region on a semiconductor substrate in such a way as to surround the circuit region and a second moisture-resistant ring disposed in the peripheral region in such a way as to surround the first moisture-resistant ring. |
Author | Sakuma Jun Ohshima Tadashi Matsumura Hideaki |
Author_xml | – fullname: Ohshima Tadashi – fullname: Matsumura Hideaki – fullname: Sakuma Jun |
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Notes | Application Number: US201715459199 |
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RelatedCompanies | MIE FUJITSU SEMICONDUCTOR LIMITED |
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Snippet | A semiconductor device includes a first moisture-resistant ring disposed in a peripheral region surrounding a circuit region on a semiconductor substrate in... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING MOISTURE-RESISTANT RINGS BEING FORMED IN A PERIPHERAL REGION |
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