METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING MOISTURE-RESISTANT RINGS BEING FORMED IN A PERIPHERAL REGION

A semiconductor device includes a first moisture-resistant ring disposed in a peripheral region surrounding a circuit region on a semiconductor substrate in such a way as to surround the circuit region and a second moisture-resistant ring disposed in the peripheral region in such a way as to surroun...

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Bibliographic Details
Main Authors Ohshima Tadashi, Matsumura Hideaki, Sakuma Jun
Format Patent
LanguageEnglish
Published 29.06.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a first moisture-resistant ring disposed in a peripheral region surrounding a circuit region on a semiconductor substrate in such a way as to surround the circuit region and a second moisture-resistant ring disposed in the peripheral region in such a way as to surround the first moisture-resistant ring.
Bibliography:Application Number: US201715459199