WARPAGE MITIGATION IN PRINTED CIRCUIT BOARD ASSEMBLIES

• Main Authors: Aoki Russell S, Hui Michael, Carstens Jonathon Robert, Ceurter Kevin J, Jasniewski Joseph J, Ferguson Shelby, Yee Rashelle
• Format: Patent
• Language: English
• Published: 22.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPUTING; COUNTING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.