SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW
Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame may comprise a two frame system. The interposer may be on a mounting table or on a circuit board. The frame may include a body with a recta...
Saved in:
Main Authors | , , , , , , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
22.06.2017
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame may comprise a two frame system. The interposer may be on a mounting table or on a circuit board. The frame may include a body with a rectangular opening dimensioned to receive a semiconductor package to be coupled to the interposer. The frame may be to align a ball grid array of the semiconductor package with pads of the interposer. A second frame may be to receive the first frame and may be to align a ball grid array of the interposer with pads of the circuit board. A single frame may be used to couple a semiconductor package to an interposer and to couple the interposer to a circuit board. Other embodiments may be described and/or claimed. |
---|---|
Bibliography: | Application Number: US201514975532 |