Method and Device for a High Temperature Vacuum-Safe Solder Stop Utilizing Laser Processing of Solderable Surfaces for an Electronic Module Assembly
A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further inclu...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
01.06.2017
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Subjects | |
Online Access | Get full text |
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Summary: | A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well. |
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Bibliography: | Application Number: US201514954243 |