CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE

A circuit substrate for a chip bonding thereon includes a core substrate having a chip-side surface and a bump-side surface opposite to the chip-side surface, a first through via plug passing through the core substrate, a pad disposed on the bump-side surface, in contact with the first through via p...

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Bibliographic Details
Main Authors HSU Yeh-Chi, KUNG Chen-Yueh
Format Patent
LanguageEnglish
Published 25.05.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A circuit substrate for a chip bonding thereon includes a core substrate having a chip-side surface and a bump-side surface opposite to the chip-side surface, a first through via plug passing through the core substrate, a pad disposed on the bump-side surface, in contact with the first through via plug, and a first thickness enhancing conductive pattern disposed on a surface of the pad, which is away from the bump-side surface.
Bibliography:Application Number: US201715423788