METHOD AND ARRANGEMENT FOR PRE-CURING AN ADHESIVE LAYER
The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first c...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
18.05.2017
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first component, the pair of electrodes applying a predetermined electrical current (I1, I2) to the first component. The invention further provides an arrangement for pre-curing a layer of adhesive. |
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Bibliography: | Application Number: US201514967330 |