Printed Circuit Board And Method Of Manufacturing The Same

Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and...

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Main Authors Choi Dae Young, Lee Sang Young, Son Kil Dong, Kim Sang Hwa, Jeong In Ho, Kwon Soon Gyu, Jeon Jae Hoon, Hwang Jung Ho, Jeong Dong Hun, Lee Han Su, Bae Yun Mi, Lee Jin Hak
Format Patent
LanguageEnglish
Published 11.05.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.
Bibliography:Application Number: US201715406132