SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

A semiconductor device includes a semiconductor die. A dielectric material surrounds the semiconductor die to form an integrated semiconductor package. There is a contact coupling to the integrated semiconductor package and configured as a ground terminal for the semiconductor package. The semicondu...

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Main Authors CHANG SHOU ZEN, YU CHEN-HUA, YANG CHING-FENG, LIN WEI-TING, TANG TZUUN, WU KAIIANG, LU CHUN-LIN, LIU MING-KAI, WANG CHUEI-TANG, WANG YEN-PING, CHEN VINCENT
Format Patent
LanguageEnglish
Published 20.04.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a semiconductor die. A dielectric material surrounds the semiconductor die to form an integrated semiconductor package. There is a contact coupling to the integrated semiconductor package and configured as a ground terminal for the semiconductor package. The semiconductor device further has an EMI (Electromagnetic Interference) shield substantially enclosing the integrated semiconductor package, wherein the EMI shield is coupled with the contact through a path disposed in the integrated semiconductor package.
Bibliography:Application Number: US201514886996