PURGE AND PUMPING STRUCTURES ARRANGED BENEATH SUBSTRATE PLANE TO REDUCE DEFECTS

• Main Authors: Chandrasekharan Ramesh, Lavoie Adrien, Swaminathan Shankar
• Format: Patent
• Language: English
• Published: 06.04.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A substrate processing system includes a processing chamber including a top surface, a bottom surface and side walls. A substrate support is arranged in the processing chamber to support a substrate during processing. A purge structure is arranged in the processing chamber below a plane occupied by the substrate during processing. The purge structure includes a first plurality of holes configured to supply purge gas to purge an area between the substrate support and the bottom surface of the processing chamber.