METHODS, DEVICES AND SYSTEMS THAT DISSIPATE HEAT AND FACILITATE OPTICAL ALIGNMENT IN OPTICAL COMMUNICATIONS MODULES

A heat dissipation system for an optical communications module is provided that includes a cold block on which the optoelectronic components and a lens assembly of an OSA of the module are mounted. The cold block has precisely-controlled mounting surface heights that precisely passively align the le...

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Bibliographic Details
Main Authors Wen Pengyue, Ritter Robert G, Meadowcroft David J.K, Xu Hui
Format Patent
LanguageEnglish
Published 30.03.2017
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:A heat dissipation system for an optical communications module is provided that includes a cold block on which the optoelectronic components and a lens assembly of an OSA of the module are mounted. The cold block has precisely-controlled mounting surface heights that precisely passively align the lens assembly in directions normal to mounting surfaces of the cold block. The cold block is made of a material of very high thermal conductivity, typically copper, so that heat generated by the optoelectronic components is dissipated into the cold block to maintain the optoelectronic components well below maximum allowable temperatures. In addition, an optical interface device of the OSA has a low-profile and an optical configuration that allows it to be used with a high optical fiber count.
Bibliography:Application Number: US201514872043