SYSTEM-IN-PACKAGES CONTAINING PREASSEMBLED SURFACE MOUNT DEVICE MODULES AND METHODS FOR THE PRODUCTION THEREOF

Methods for producing System-in-Packages (SiPs) containing embedded Surface Mount Device (SMD) modules are provided, as SiPs containing SMD modules. In one embodiment, the fabrication method includes positioning a semiconductor die and first preassembled SMD module, which contains a plurality of SMD...

Full description

Saved in:
Bibliographic Details
Main Author YAP WENG F
Format Patent
LanguageEnglish
Published 16.03.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Methods for producing System-in-Packages (SiPs) containing embedded Surface Mount Device (SMD) modules are provided, as SiPs containing SMD modules. In one embodiment, the fabrication method includes positioning a semiconductor die and first preassembled SMD module, which contains a plurality of SMDs soldered to an interposer substrate, in predetermined spatial relationship. The preassembled SMD module and the semiconductor die are overmolded to yield a molded panel having a frontside at which the first preassembled SMD module and the semiconductor die are exposed. A Redistribution Layer (RDL) structure can be formed over the frontside of the molded panel containing interconnect lines electrically coupling the semiconductor die and the first preassembled SMD module. The molded panel may then undergo singulation to produce an SiP having a molded body in which the semiconductor die and the first preassembled SMD module are embedded.
Bibliography:Application Number: US201514850544