SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

A semiconductor structure includes a substrate, a die disposed over the substrate, and including a die pad disposed over the die and a seal ring disposed at a periphery of the die and electrically connected with the die pad, a polymeric layer disposed over the die, a via extending through the polyme...

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Main Authors CHANG SHOU ZEN, LIN IN-TSANG, TANG TZUUN, CHEN WEI-TING, WU KAIIANG, LU CHUN-LIN, WANG CHUEI-TANG, CHEN VINCENT
Format Patent
LanguageEnglish
Published 02.03.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor structure includes a substrate, a die disposed over the substrate, and including a die pad disposed over the die and a seal ring disposed at a periphery of the die and electrically connected with the die pad, a polymeric layer disposed over the die, a via extending through the polymeric layer and electrically connected with the die pad, and a molding disposed over the substrate and surrounding the die and the polymeric layer, wherein the seal ring is configured for grounding.
Bibliography:Application Number: US201514840808