EMI SHIELD TO SUPPRESS EMI LEAKAGE FROM ONE OR MORE OPTICAL PORTS OF AN OPTICAL COMMUNICATIONS MODULE

In one exemplary embodiment, an optical communications module includes an upper housing portion mated to a lower housing portion with an optical port projecting through an opening in a front surface of the mated assembly. Electronic circuit housed inside the mated assembly can lead to electromagneti...

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Bibliographic Details
Main Authors Seetharam Venkatesh, Priyadarshi Sunil, Ritter Robert, Yashar Frank
Format Patent
LanguageEnglish
Published 02.03.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PRINTED CIRCUITS
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Summary:In one exemplary embodiment, an optical communications module includes an upper housing portion mated to a lower housing portion with an optical port projecting through an opening in a front surface of the mated assembly. Electronic circuit housed inside the mated assembly can lead to electromagnetic interference (EMI) leakage through a front surface of the mated assembly, especially through the opening that accommodates the optical port. An EMI shield, which is used to address the EMI leakage, includes an annular array of resilient metal fingers that press against a metal flange of the optical port, and also includes at least two peripheral edges each incorporating an array of resilient metal fingers that press against a metal portion of the mated assembly. An interdigital spacing in the annular array and/or the array of resilient metal fingers is defined on the basis of a wavelength associated with the EMI radiation.
Bibliography:Application Number: US201514839107