METHOD, A SEMICONDUCTOR DEVICE AND A LAYER ARRANGEMENT

A semiconductor device may include: a substrate; a metallization layer disposed at least one of in or over the substrate; a protection layer disposed at least partially over the metallization layer, wherein the metallization layer includes at least one of: copper, aluminum, gold, silver; and wherein...

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Bibliographic Details
Main Authors PELZER RAINER, YEDURU SRINIVASA REDDY, WOEHLERT STEFAN
Format Patent
LanguageEnglish
Published 23.02.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device may include: a substrate; a metallization layer disposed at least one of in or over the substrate; a protection layer disposed at least partially over the metallization layer, wherein the metallization layer includes at least one of: copper, aluminum, gold, silver; and wherein the protection layer includes a nitride material including at least one of: copper, aluminum, gold, silver.
Bibliography:Application Number: US201514831937