HYBRID CORRECTIVE PROCESSING SYSTEM AND METHOD
A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of para...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
23.02.2017
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data. |
---|---|
Bibliography: | Application Number: US201615242376 |