SEMICONDUCTOR APPARATUS AND CLEANING METHOD FOR THE SEMICONDUCTOR APPARATUS

• Main Authors: LIN Jyh-Nan, TSENG Yin-Bin, LIU Ding-I, LU Yu-Ying, LEU Po-Hsiung
• Format: Patent
• Language: English
• Published: 23.02.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A semiconductor apparatus is provided. The semiconductor apparatus includes a process chamber, a wafer chuck disposed in the process chamber, and an exhaust device. The exhaust device includes an exhaust tube that communicates with the process chamber, and a valve mechanism installed on the exhaust tube and configured to control the flow rate in the exhaust tube. The semiconductor apparatus further includes a cleaning-gas-supply device including a first cleaning tube that communicates with the process chamber, and a second cleaning tube that communicates with the exhaust device. When a cleaning process is performed, the cleaning-gas-supply device supplies a cleaning gas into the process chamber via the first cleaning tube, and into the valve mechanism via the second cleaning tube.