SOCKET APPARATUS FOR SEMICONDUCTOR DEVICE TEST

Disclosed a socket apparatus for a semiconductor device test, the apparatus including: body elements (100, 200) into which contacts (400) are inserted; movable elements (300, 500) on which a semiconductor device (IC) is seated; a socket cover (600) assembled to the movable elements (300, 500) and re...

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Bibliographic Details
Main Authors HWANG Dong Weon, Hwang Jae Suk, HWANG Jae Baek
Format Patent
LanguageEnglish
Published 16.02.2017
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:Disclosed a socket apparatus for a semiconductor device test, the apparatus including: body elements (100, 200) into which contacts (400) are inserted; movable elements (300, 500) on which a semiconductor device (IC) is seated; a socket cover (600) assembled to the movable elements (300, 500) and resiliently assembled to the body elements (100, 200); and a semiconductor device pressing part (700) pressing and fixing the semiconductor device (IC) seated on the movable elements (300, 500), wherein the semiconductor device pressing part (700) includes: a pusher plate (710) having an opening cam (711) and coming into surface contact with an upper surface of the semiconductor device (IC) and applies pressure thereto; a latch (720) of which ends are hingedly assembled to the socket cover (600) and the pusher plate (710); and a link (730) of which ends are hingedly assembled to the socket body (100) and the latch (720).
Bibliography:Application Number: US201515306151