HIGH-SPEED FILLING METHOD FOR COPPER

• Main Authors: OMORI Takafumi, YASUDA Kiroki, ANDO Syunsuke
• Format: Patent
• Language: English
• Published: 16.02.2017
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

To provide a technique of increasing a rate of filling holes or grooves formed in a substrate, by changing the temperature, the concentration, the current density, and the other conditions of the ordinary copper plating. A method for filling holes or grooves formed in a substrate by copper plating a...